| Title |
PVD Depostion of Nb₃Sn Thin Film on Copper Substrate from an Alloy Nb₃Sn Target |
| Authors |
- R. Valizadeh, S. Aliasghari, A.N. Hannah, O.B. Malyshev
STFC/DL/ASTeC, Daresbury, Warrington, Cheshire, United Kingdom
- K. Dawson, V.R. Dhanak
The University of Liverpool, Liverpool, United Kingdom
- G.B.G. Stenning
STFC/RAL/ISIS, Chilton, Didcot, Oxon, United Kingdom
- D. Turner
STFC/DL, Daresbury, Warrington, Cheshire, United Kingdom
- D. Turner
Cockcroft Institute, Lancaster University, Lancaster, United Kingdom
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| Abstract |
In this study we report on the PVD deposition of Nb₃Sn on Cu substrates with and without a thick Nb interlayer to produce Cu/Nb/Nb₃Sn and Cu/Nb₃Sn multilayer structures. The Nb₃Sn was sputtered directly from an alloy target at room and elevated temperatures. The dependence of the superconducting properties of the total structure on deposition parameters has been determined. The films have been characterized via SEM, XRD, EDX and SQUID magnetometer measurements. Analysis showed that the composition at both room and elevated temperature was within the desired stoichiometry of 24’25 at%. However, superconductivity was only observed for deposition at elevated temperature or post annealing at 650 °C. The critical temperature was determined to be in the range of 16.8 to 17.4 K. In the case of bilayer deposition, copper segregation from the interface all the way to the surface was observed.
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| Paper |
download WEPRB011.PDF [1.240 MB / 4 pages] |
| Export |
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| Conference |
IPAC2019 |
| Series |
International Particle Accelerator Conference (10th) |
| Location |
Melbourne, Australia |
| Date |
19-24 May 2019 |
| Publisher |
JACoW Publishing, Geneva, Switzerland |
| Editorial Board |
Mark Boland (UoM, Saskatoon, SK, Canada); Hitoshi Tanaka (KEK, Tsukuba, Japan); David Button (ANSTO, Kirrawee, NSW, Australia); Rohan Dowd (ANSTO, Kirrawee, NSW, Australia); Volker RW Schaa (GSI, Darmstadt, Germany); Eugene Tan (ANSTO, Kirrawee, NSW, Australia) |
| Online ISBN |
978-3-95450-208-0 |
| Received |
14 May 2019 |
| Accepted |
23 May 2019 |
| Issue Date |
21 June 2019 |
| DOI |
doi:10.18429/JACoW-IPAC2019-WEPRB011 |
| Pages |
2818-2821 |
| Copyright |
 Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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