Title |
Characterization and Simulation of Optical Delay System for the Proof-of-Principle Experiment of Optical Stochastic Cooling at IOTA |
Authors |
- A.J. Dick, P. Piot
Northern Illinois University, DeKalb, Illinois, USA
- J.D. Jarvis
Fermilab, Batavia, Illinois, USA
- P. Piot
ANL, Lemont, Illinois, USA
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Abstract |
The Optical Stochastic Cooling (OSC) experiment at Fermilab’s IOTA storage ring uses two undulators to cool the beam over many turns. The radiation emitted by electrons in the first undulator is delayed and imaged in the second undulator where it applies a corrective energy kick on the electrons. Imperfections in the manufacturing of the delay plates can lead to a source of error. This paper presents the experimental characterization of the absolute thickness of these delay plates using an interferometric technique. The measured "thickness maps" are implemented in the Synchrotron Radiation Workshop (SRW) program to assess their impact on the delayed radiation pulse.
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Funding |
CBB NSF-PHY-1549132 DOE DE-SC0018656 DOE DE-AC02-07CH11359 |
Paper |
download WEPAB270.PDF [1.880 MB / 4 pages] |
Poster |
download WEPAB270_POSTER.PDF [2.578 MB] |
Export |
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Conference |
IPAC2021 |
Series |
International Particle Accelerator Conference (12th) |
Location |
Campinas, SP, Brazil |
Date |
24-28 May 2021 |
Publisher |
JACoW Publishing, Geneva, Switzerland |
Editorial Board |
Liu Lin (LNLS, Campinas, Brazil); John M. Byrd (ANL, Lemont, IL, USA); Regis Neuenschwander (LNLS, Campinas, Brazil); Renan Picoreti (LNLS, Campinas, Brazil); Volker R. W. Schaa (GSI, Darmstadt, Germany) |
Online ISBN |
978-3-95450-214-1 |
Online ISSN |
2673-5490 |
Received |
16 May 2021 |
Accepted |
05 July 2021 |
Issue Date |
22 August 2021 |
DOI |
doi:10.18429/JACoW-IPAC2021-WEPAB270 |
Pages |
3269-3272 |
Copyright |
Published by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI. |
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