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https://doi.org/10.18429/JACoW-SRF2019-TUP019
Title Status of High Temperature Vacuum Heat Treatment Program at IPN Orsay
Authors
  • M. Fouaidy, F. Chatelet, V. Delpech, F. Galet, D. Le Dréan, R. Martret, G. Olry, T. Pépin-Donat
    Université Paris-Saclay, CNRS/IN2P3, IJCLab, Orsay, France
  • M. Baudrier, P. Carbonnier, E. Fayette, X. Hanus, Th. Proslier, D. Roudier, P. Sahuquet, C. Servouin
    CEA-DRF-IRFU, France
  • E. Cenni, L. Maurice
    CEA-IRFU, Gif-sur-Yvette, France
  • D. Longuevergne
    FLUO, Orsay, France
Abstract In the framework of ESS, a vacuum furnace dedicated to High Temperature Heat Treatment under Vacuum (VH2T2) of SRF bulk Nb cavities was developed and commissioned in May 2016. This furnace is currently used for interstitial hydrogen removal (10h00 @ 650 °C) of two type of cavities: 1) the whole series of 26 ESS 352 MHz spoke resonators equipped with their Ti LHe tank well, 2) some prototypes of ESS high beta and medium beta cavities. Up to know IPN Orsay VH2T2 (10h00 @ 650 °C) was successfully applied to more than 16 cavities. In this paper we will first report about these VH2T2 tests. Finally, we have just started testing nitrogen infusion and nitrogen doping processes on samples and 1.3 GHz cavities: the preliminary results will be discussed.
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Conference SRF2019
Series International Conference on RF Superconductivity (19th)
Location Dresden, Germany
Date 30 June-05 July 2019
Publisher JACoW Publishing, Geneva, Switzerland
Editorial Board Peter Michel (HZDR, Dresden, Germany); André Arnold (HZDR, Dresden, Germany); Volker RW Schaa (GSI, Darmstadt, Germany)
Online ISBN 978-3-95450-211-0
Online ISSN ""
Received 03 July 2019
Accepted 04 July 2019
Issue Date 14 August 2019
DOI doi:10.18429/JACoW-SRF2019-TUP019
Pages 438-443
Copyright
Creative Commons CC logoPublished by JACoW Publishing under the terms of the Creative Commons Attribution 3.0 International license. Any further distribution of this work must maintain attribution to the author(s), the published article's title, publisher, and DOI.